Device manufacturing method, top coat material and substrate

Semiconductor device manufacturing: process – Radiation or energy treatment modifying properties of...

Reexamination Certificate

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Reexamination Certificate

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07491661

ABSTRACT:
In immersion lithography, to avoid internal reflections in the final element of the projection system, immersion fluid and topcoat, the thicknesses, dl, dtcand dr, and refractive indices, nl, ntcand nr, of the immersion fluid, topcoat and resist may meet the following criteria:in-line-formulae description="In-line Formulae" end="lead"?nl≦ntc≦nrin-line-formulae description="In-line Formulae" end="tail"?in-line-formulae description="In-line Formulae" end="lead"?dl>˜5.λin-line-formulae description="In-line Formulae" end="tail"?in-line-formulae description="In-line Formulae" end="lead"?dtc≦˜5.λin-line-formulae description="In-line Formulae" end="tail"?

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