Device having resin package and method of producing the same

Details Device having resin package and method of producing the same Device having resin package and method of producing the same

2006-12-05

2006-12-05

Trinh, Michael (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S123000, C438S124000

Reexamination Certificate

active

07144754

ABSTRACT:
A device including a chip, and a resin package sealing the chip, the resin package having resin projections located on a mount-side surface of the resin package. Metallic films are respectively provided to the resin projections. Connecting parts electrically connect electrode pads of the chip and the metallic film.

REFERENCES:
patent: 4635356 (1987-01-01), Ohuchi et al.
patent: 4724280 (1988-02-01), Tsuji et al.
patent: 5200362 (1993-04-01), Lin et al.
patent: 5214308 (1993-05-01), Nishiguchi et al.
patent: 5273938 (1993-12-01), Lin et al.
patent: 5410451 (1995-04-01), Hawthorne et al.
patent: 5440169 (1995-08-01), Tomita et al.
patent: 5502631 (1996-03-01), Adachi
patent: 5521427 (1996-05-01), Chia et al.
patent: 5523628 (1996-06-01), Williams et al.
patent: 5567984 (1996-10-01), Zalesinski et al.
patent: 5581122 (1996-12-01), Chao et al.
patent: 5625230 (1997-04-01), Park et al.
patent: 5629566 (1997-05-01), Doi et al.
patent: 5631499 (1997-05-01), Hosomi et al.
patent: 5633535 (1997-05-01), Chao et al.
patent: 5666008 (1997-09-01), Tomita et al.
patent: 5670826 (1997-09-01), Bessho et al.
patent: 6001671 (1999-12-01), Fjelstad
patent: 0 638 933 (1995-02-01), None
patent: 0 751 561 (1997-01-01), None
patent: 2 691 836 (1993-12-01), None
patent: 59-47749 (1984-03-01), None
patent: 59-208756 (1984-11-01), None
patent: 60-86851 (1985-05-01), None
patent: 61-135131 (1986-06-01), None
patent: 61-237454 (1986-10-01), None
patent: 1-125941 (1989-05-01), None
patent: 1-137654 (1989-05-01), None
patent: 1-161724 (1989-06-01), None
patent: 1-179334 (1989-07-01), None
patent: 2-112264 (1990-04-01), None
patent: 3-94438 (1991-04-01), None
patent: 3-94459 (1991-04-01), None
patent: 3-178152 (1991-08-01), None
patent: 3-240260 (1991-10-01), None
patent: 5-129473 (1993-05-01), None
patent: 5-218509 (1993-08-01), None
patent: 5-251455 (1993-09-01), None
patent: 6-151520 (1994-05-01), None
patent: 6-310563 (1994-11-01), None
patent: 7-058161 (1995-03-01), None
patent: 7-161746 (1995-06-01), None
patent: 07-226475 (1995-08-01), None
patent: 7-235618 (1995-09-01), None
patent: 7-307409 (1995-11-01), None
patent: 95/26047 (1995-09-01), None
patent: 96/09646 (1996-03-01), None
Chinese Office Action dated Nov. 11, 2005 received on corresponding Chinese application with English translation; 8 pages.
Communication from the European Patent Office dated Apr. 26, 2006; 5 pages.

Affiliated with

Also associated with

Rating

Device having resin package and method of producing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Device having resin package and method of producing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device having resin package and method of producing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3717370