Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate
2005-04-19
2005-04-19
Lebentritt, Michael (Department: 2824)
Active solid-state devices (e.g., transistors, solid-state diode
Field effect device
Having insulated electrode
C257S421000
Reexamination Certificate
active
06881993
ABSTRACT:
A method and apparatus are disclosed for inhibiting diffusion of mobile atoms from an antiferromagnetic layer toward a tunnel oxide layer and through a ferromagnetic layer which is pinned by the antiferromagnetic layer. Diffusion of the mobile atoms is inhibited by an oxide layer provided between the anti-ferromagnetic layer and the ferromagnetic layer. Alternatively, the ferromagnetic layer can have boron atoms located on or in the layer to fill interstices.
REFERENCES:
patent: 5569617 (1996-10-01), Yeh et al.
patent: 5691865 (1997-11-01), Johnson et al.
patent: 6438026 (2002-08-01), Gillies et al.
patent: 6532164 (2003-03-01), Redon et al.
patent: 6580270 (2003-06-01), Coehoorn
patent: 6633498 (2003-10-01), Engel et al.
patent: 6636436 (2003-10-01), Perner
patent: 6677631 (2004-01-01), Drewes
patent: 6710986 (2004-03-01), Sato et al.
patent: 6714444 (2004-03-01), Huai et al.
patent: 6751074 (2004-06-01), Inomata et al.
patent: 6756239 (2004-06-01), Nickel et al.
patent: 6778433 (2004-08-01), Tang
patent: 6795336 (2004-09-01), Kim et al.
patent: 6807091 (2004-10-01), Saito
patent: 6816347 (2004-11-01), Koi et al.
Drewes Joel A.
Gafron Terry
Dickstein , Shapiro, Morin & Oshinsky, LLP
Lebentritt Michael
Micro)n Technology, Inc.
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