Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1996-12-24
1998-10-27
Woodward, Michael P.
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
216 91, C23F 100, C03C 2506
Patent
active
058273964
ABSTRACT:
A wet etching device used in manufacturing a semiconductor device includes a power source, a transmission device for transmitting power from the power source, and a roller for reversing top and bottom positions of a wafer placed in a processing bath using power from the power source transmitted by the transmission device. Here, the initial top and bottom positions of the wafer during loading are reversed before unloading. Accordingly, the entire surface of the wafer spends an equal amount of time in the processing bath containing a chemical solution and can thus be etched uniformly.
REFERENCES:
patent: 3766046 (1973-10-01), Flint
patent: 4376482 (1983-03-01), Wheeler et al.
patent: 5046909 (1991-09-01), Murdoch
Jeon Pyeong-sik
Ko Se-jong
Moon Sang-young
Yun Young-hwan
Brumback Brenda G.
Samsung Electronics Co,. Ltd.
Woodward Michael P.
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