Device for turning a wafer during a wet etching process

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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Details

216 91, C23F 100, C03C 2506

Patent

active

058273964

ABSTRACT:
A wet etching device used in manufacturing a semiconductor device includes a power source, a transmission device for transmitting power from the power source, and a roller for reversing top and bottom positions of a wafer placed in a processing bath using power from the power source transmitted by the transmission device. Here, the initial top and bottom positions of the wafer during loading are reversed before unloading. Accordingly, the entire surface of the wafer spends an equal amount of time in the processing bath containing a chemical solution and can thus be etched uniformly.

REFERENCES:
patent: 3766046 (1973-10-01), Flint
patent: 4376482 (1983-03-01), Wheeler et al.
patent: 5046909 (1991-09-01), Murdoch

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