Device for testing electrical characteristics of chips

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure

Reexamination Certificate

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C257S734000, C257S736000

Reexamination Certificate

active

06878963

ABSTRACT:
The present invention discloses a device for testing electrical characteristics of a chip, which is capable of verifying whether each chip can meet the requirement of the electrical specifications, and sort out the chips under the specifications. The invention utilizes a probe to contact the extension area of the under bump metallurgy to detect if the electrical characteristics of the chip can meet the requirement of the specifications. As the bumps on the chip do not actually contact the probe, the intact profile for the bumps on the chips can be assuredly kept so that the problem of voids existing in the melted bumps during reflow process can be avoided.

REFERENCES:
patent: 5597737 (1997-01-01), Greer et al.
patent: 6249044 (2001-06-01), Kao et al.
patent: 6251501 (2001-06-01), Higdon et al.
patent: 6426281 (2002-07-01), Lin et al.
patent: 6518161 (2003-02-01), Rajagopalan et al.
patent: 6596618 (2003-07-01), Narayanan et al.
patent: 6639314 (2003-10-01), Boettcher et al.

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