Device for sputtering a metallic material on a plate

Details Device for sputtering a metallic material on a plate Device for sputtering a metallic material on a plate

1995-06-16

1997-02-25

Nguyen, Nam

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20419226, 20429811, 20429825, 20429826, C23C 1434

Patent

active

056056087

ABSTRACT:
A device for sputtering a metallic material on a plate comprises a vacuum chamber provided with a linear conveyor carrying at least one plate, the plate surface to be processed being turned downward. At least two sputtering sources are disposed under the conveyor, perpendicularly to its moving direction. Each source is associated with a collimator. The sputtering sources and their associated collimators are disposed to coat the whole width of the plate.

REFERENCES:
patent: 4278528 (1981-07-01), Kuehnle et al.
patent: 4857161 (1989-08-01), Borel et al.
patent: 4981566 (1991-01-01), Wurczinger
patent: 5084151 (1992-01-01), Vallana et al.
patent: 5180476 (1993-01-01), Ishibashi et al.
patent: 5350498 (1994-09-01), Smith, Jr. et al.

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