Device for removing objects adhered to a plate for bonding a sem

Details Device for removing objects adhered to a plate for bonding a sem Device for removing objects adhered to a plate for bonding a sem

1997-05-30

1999-06-15

Graham, Gary K.

Brushing, scrubbing, and general cleaning

Machines

Brushing

15 77, 15102, 279106, H01L 21304

Patent

active

059112573

ABSTRACT:
A device for removing objects adhered to a plate for bonding a semiconductor wafer, which can efficiently and completely remove the objects adhered on the chamfered portion of the bonding plate. The rotating shaft 12 of the head for removing adhered objects from the peripheral surface is inclinatorily mounted with respect to the top surface 52 of the bonding plate 5. The peripheral chamfered portion 51 is not aligned with the extended line of the central line 12c of the rotating shaft 12. The upper peripheral surface 21a of the outer tip 21 of the chuck 2 is inclinatorily mounted.

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