Metal working – Means to assemble or disassemble – By deforming
Patent
1993-05-05
1994-10-04
Vo, Peter Dungba
Metal working
Means to assemble or disassemble
By deforming
29282, 294264, 29722, 29777, 83944, B23Q 704, B26D 701, B23P 1902
Patent
active
053513819
ABSTRACT:
The device for removing a hypodermic needle from a syringe body and for simultaneously distorting the hypodermic needle comprises a receptacle, a guiding structure for guiding the hypodermic needle into the receptacle, a mechanism for engaging, pulling and simultaneously distorting the hypodermic needle adjacent to the guiding structure and a mechanism for operating the engaging, pulling and distorting mechanism to pull the needle into the receptacle, the guiding structure includes an abutment for preventing the syringe body from entering the receptacle and the mechanism for engaging, pulling and distorting the needle includes a pair of intermeshing gears.
REFERENCES:
patent: 3404593 (1966-07-01), Arcarese et al.
patent: 3683733 (1972-08-01), Johan et al.
patent: 3785233 (1974-01-01), Robinson
patent: 3800644 (1974-04-01), Garvis et al.
patent: 4255996 (1981-03-01), Choksi et al.
patent: 4275628 (1981-06-01), Greenhouse
patent: 4332323 (1982-01-01), Reenstierna
patent: 4404881 (1983-09-01), Hanifl
patent: 4531437 (1985-07-01), Szablak et al.
patent: 4649607 (1987-03-01), Kuhn, II
patent: 4807344 (1989-02-01), Kelson et al.
patent: 4969379 (1990-11-01), Taylor et al.
patent: 5091621 (1992-02-01), Butler
patent: 5138124 (1992-08-01), Kirk et al.
patent: 5138125 (1992-08-01), Salesses
Dungba Vo Peter
Vigil Thomas R.
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