Device for liquid treatment of wafer-shaped articles

Details Device for liquid treatment of wafer-shaped articles Device for liquid treatment of wafer-shaped articles

2007-02-06

2007-02-06

Lund, Jeffrie R. (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

For liquid etchant

C156S345110, C156S345230, C156S345300, C156S345550, C134S099100, C134S140000, C134S149000, C134S153000, C134S157000, C118S052000, C118S300000, C118S301000, C118S504000

Reexamination Certificate

active

09984707

ABSTRACT:
A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, in which a mask is kept at a defined short distance to the wafer-shaped article such that liquid can be retained between the mask and the defined area of the wafer-shaped article by capillary forces.

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