Device fabrication method using spin-on glass resins

Details Device fabrication method using spin-on glass resins Device fabrication method using spin-on glass resins

1985-02-04

1987-07-28

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156646, 156652, 156657, 1566611, 156668, 156904, 20419232, 427 38, 427 431, 430317, B44C 122, C03C 1500, C03C 2506

Patent

active

046830243

ABSTRACT:
A new method for fabricating a device, such as a semiconductor device, is disclosed. The method includes the step of patterning a substrate with a trilevel resist containing a spin-deposited substitute for the conventional central, silicon dioxide region. This substitute includes an organosilicon glass resin in combination with metal-and-oxygen containing material. The inventive method prevents the losses of linewidth control, and avoids the pattern degradation due to undesirably many pinholes, of previous such methods.

REFERENCES:
patent: 4244799 (1981-01-01), Fraser et al.

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