Device fabrication by plasma etching

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156646, 156657, 1566591, 156662, 204192E, 252 791, H01L 21306

Patent

active

043148751

ABSTRACT:
Etch rate in plasma-assisted etching is increased by inclusion of an additional oxidant. The oxidant increases consumption of unsaturates in the plasma to increase etchant species lifetime and to suppress polymer formation.

REFERENCES:
patent: 4162185 (1979-07-01), Cobunn et al.
patent: 4211601 (1980-07-01), Mogab

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