Device, design and method for a slot in a conductive area

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design

Reexamination Certificate

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Details

C716S030000, C716S030000, C716S030000

Reexamination Certificate

active

07089522

ABSTRACT:
A design, device, system and process for placing slots in active regions (e.g., metal areas). Embodiments of the present invention improve the planarization of metal areas (e.g., lines) and insulators by reducing depressions (e.g., dishing) in the metal areas by including symmetric or square slots inside selected wide metal lines, by adhering to a set of placement rules. Embodiments reduce dishing in copper dual damascene structures. Embodiments reduce data processing requirements for designing and arranging the layout of IC devices and the slots.

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Andrew B. Kahng et al., “Filling and Slotting: Analysis and Algorithms”, ISPD 98 Monterey CA USA, p. 95-102.

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