Device and process involving pinhole undercut area

Details Device and process involving pinhole undercut area Device and process involving pinhole undercut area

2008-08-18

2010-10-26

Pham, Thanh V (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Field effect device

Having insulated electrode

C257S040000, C257S288000, C257S621000, C257SE51006

Reexamination Certificate

active

07821068

ABSTRACT:
An electronic device fabrication method including: (a) providing a dielectric region and a lower electrically conductive region, wherein the dielectric region includes a plurality of pinholes each with an entry and an exit; and (b) depositing an etchant for the lower electrically conductive region into the pinholes that undercuts the pinholes to create for a number of the pinholes an overhanging surface of the dielectric region around the exit facing an undercut area of the lower electrically conductive region wider than the exit.

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