Device and method of manufacture for an integrated circuit havin

Details Device and method of manufacture for an integrated circuit havin Device and method of manufacture for an integrated circuit havin

1998-02-12

1999-10-12

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Test or calibration structure

257758, 257773, 257786, H01L 2348

Patent

active

059659033

ABSTRACT:
The present invention provides, in one embodiment, an integrated circuit having a substrate and active devices formed on the surface of the substrate. Other embodiments of the integrated circuit provide for having at least either three or four metal layers. In a particular embodiment of the present invention, the integrated circuit comprises a bond pad formed over a portion of the active devices. The bond pad has a footprint. As used therein the word footprint means the area covered by the device to which the word refers. The integrated circuit further incudes a patterned metal layer having a metal layer footprint that is located between the bond pad and the substrate and a built-in self-test (BIST) circuit that has a BIST footprint, which is located between the substrate and the bond pad. In this particular embodiment, the bond pad footprint overlays at least a portion of the metal layer footprint and the BIST footprint. However, in a more advantageous embodiment, the bond pad footprint overlays a substantial portion of the metal layer footprint and the BIST footprint.

REFERENCES:
patent: 4636832 (1987-01-01), Abe et al.
patent: 4984061 (1991-01-01), Matsumoto
patent: 5502337 (1996-03-01), Nozaki
K. Mukai, A. Hiraiwa, S. Muramatsu, I. Yoshida and S. Harada; "A New Integration Technology That Enables Forming Bonding Pads on Active Areas"; IEDM 1981; pp. 62-65.

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