Device and method for reducing thermal cycling in a semiconducto

Details Device and method for reducing thermal cycling in a semiconducto Device and method for reducing thermal cycling in a semiconducto

1994-08-03

1999-05-04

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257707, 257713, 257777, 361723, H05K 720

Patent

active

059010436

ABSTRACT:
In semiconductor packaging, a method and device for reducing thermal stress on a die and for reinforcing the strength of a die. A thermally-conductive member is positioned in a cooperating manner with the die during the packaging process.

REFERENCES:
patent: 5339216 (1994-08-01), Lin et al.

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