Device and method for reducing thermal cycling in a semiconducto

Details Device and method for reducing thermal cycling in a semiconducto Device and method for reducing thermal cycling in a semiconducto

1993-03-02

1994-08-16

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257707, 257713, 257777, 361723, H05K 720

Patent

active

053392167

ABSTRACT:
In semiconductor packing, a method and device for reducing thermal stress on a die and for reinforcing the strength of a die, A thermally-conductive member is positioned in a cooperating manner with the die during the packaging process.

REFERENCES:
patent: 4081825 (1978-03-01), Koopman et al.
IBM Tech. Disc Bulletin, vol. 29, No. 3 Aug. 1986 "Reworkable Chip-on-Board Package" pp. 1433-1434.

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