Device and method for liquid treatment of wafer-shaped articles

Details Device and method for liquid treatment of wafer-shaped articles Device and method for liquid treatment of wafer-shaped articles

2006-05-18

2011-10-04

MacArthur, Sylvia R. (Department: 1716)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

For liquid etchant

C156S345550

Reexamination Certificate

active

08029641

ABSTRACT:
Method and device for wet treating a defined peripheral edge-region of a wafer-shaped article having a first surface plane W1, a second surface plane W2and an edge surface. The device includes a support for holding the wafer-shaped article; liquid dispensing members for dispensing liquid onto the first surface plane W1of the wafer-shaped article not facing the support and liquid guiding member connected to the support for guiding at least a part of the liquid around the edge surface of the wafer-shaped article towards the second surface plane W2of the wafer-shaped article facing the support thereby wetting at least the edge surface, wherein the liquid guiding member has the form of a ring.

REFERENCES:
patent: RE37347 (2001-09-01), Maekawa et al.
patent: 6435200 (2002-08-01), Langen
patent: 2002/0050244 (2002-05-01), Engesser
patent: 2002/0189652 (2002-12-01), Peace et al.
patent: 2003/0101929 (2003-06-01), Yoshihara et al.
patent: 2004/0255985 (2004-12-01), Xia et al.
International Search Report of PCT/EP2006/062412 filed May 18, 2006, date of mailing Oct. 16, 2006.

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