Device and method for determining the lateral undercut of a...

Details Device and method for determining the lateral undercut of a... Device and method for determining the lateral undercut of a...

2005-06-28

2005-06-28

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Including control responsive to sensed condition

Electrical characteristic sensed

C438S381000

Reexamination Certificate

active

06911348

ABSTRACT:
A device and a method for determining the extent of an at least locally lateral undercut of a structured surface layer on a sacrificial layer. The structured surface layer for this purpose locally has at least one passive electronic component, using which a physical measured quantity can be determined, which is proportional to the extent of the lateral undercut. The method for generating this device proposes, initially on the structured surface layer in a first etching method, to provide the surface layer at least locally with a structuring having trenches and, in a second etching method, proceeding from the trenches, to undertake at least locally a lateral undercut of the structured surface layer. In this context, in the first etching method on the surface layer, locally at least one passive electronic component is additionally delineated out, which in response to a subsequent undercutting of the surface layer is also undercut. The physical measured quantity is determined without contact, preferably by sending an electromagnetic emission into the passive component.

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Zincke et al.,Test Structure for Determining Design Rules for Microelectromechanial-Based Sensors and Actuators, ICMTS, US, NY, IEEE, 1994.

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