Device and method for cutting semiconductor-crystal bars

Details Device and method for cutting semiconductor-crystal bars Device and method for cutting semiconductor-crystal bars

1998-01-29

1999-12-28

Scherbel, David A.

Stone working

Sawing

Reciprocating

125 21, B28D 108

Patent

active

060067373

ABSTRACT:
A plurality of wires are stretched in parallel through wire supplying-winding apparatuses and wire-tension adjusting apparatuses. A semiconductor-crystal bar is affixed on an ascent/descent table via a feeding table. The ascent/descent table is capable of being driven to ascend or descend by the ascent/descent apparatus. The wires and the semiconductor-crystal bar are dipped into a high-insulation oil, and discharging is created therebetween to perform cutting. If the resistance of the semiconductor-crystal bar exceeds 1 .OMEGA..multidot.cm, used inert gas is filled into a space within the interior space of an airtight vessel. Then, the high-insulation oil is heated by heaters and is kept at a temperature higher than 150.degree. C. to reduce the resistance of the semiconductor-crystal bar. Therefore, cutting is easily performed. The used inert gas can prevent fire from occurring due to the flaming of the high-insulation oil.

REFERENCES:
patent: 5201305 (1993-04-01), Takeuchi
patent: 5269285 (1993-12-01), Toyama et al.
patent: 5429163 (1995-07-01), Frenkel et al.

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