Developing solution for negative type photosensitive resin compo

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Finishing or perfecting composition or product

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

430325, 430309, G03F 732

Patent

active

057562679

ABSTRACT:
A developing solution for negative type photo-sensitive resin compositions which comprises an aqueous solution containing 0.01 to 1.5% by weight of at least one compound selected from quaternary ammonium bases represented by formula (I): ##STR1## wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are the same or different, and are groups selected from the class consisting of alkyl and hydroxyalkyl groups, each group having 1 to 6 carbon atoms, and containing a nonionic, cationic or amphoteric surface active agent. The developing solution allows for development of sharp image patterns within a short period without forming mottles.

REFERENCES:
patent: 4239661 (1980-12-01), Muraoka et al.
patent: 4374920 (1983-02-01), Wanat et al.
patent: 4565768 (1986-01-01), Nonogaki et al.
patent: 4801519 (1989-01-01), Koibuchi et al.
patent: 4806453 (1989-02-01), Vidusek et al.
patent: 4808513 (1989-02-01), Lazarus et al.
patent: 4833067 (1989-05-01), Tanaka et al.
patent: 4914006 (1990-04-01), Kato et al.
patent: 5019488 (1991-05-01), Mammato et al.
patent: 5126230 (1992-06-01), Lazarus et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Developing solution for negative type photosensitive resin compo does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Developing solution for negative type photosensitive resin compo, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Developing solution for negative type photosensitive resin compo will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1958701

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.