Electrical computers and digital processing systems: interprogra – Common gateway interface program communication
Reexamination Certificate
2007-02-14
2011-10-18
Puente, Emerson (Department: 2196)
Electrical computers and digital processing systems: interprogra
Common gateway interface program communication
C719S313000, C719S319000, C719S320000, C719S328000
Reexamination Certificate
active
08042118
ABSTRACT:
Mechanisms for developing Diameter applications are provided. The mechanisms extend the application server servlet model to support Diameter applications. A “base protocol” servlet is provided that handles the basic Diameter protocol functionality. Base application servlets are provided for each Diameter interface (for example, an “Sh” base servlet for the IMS “Sh” interface). These servlets are base classes for application code. The base application servlets implement additional semantics on top of the base protocol servlet to support additional attribute-value pair semantics. With the system and method, Diameter servlets share the same ServletContext as HTTP and SIP servlets. This mechanism facilitates communication between the various application entities and facilitates generation of converged applications.
REFERENCES:
Calhoun et al. Diameter Base Protocol. [online] (Sep. 2003). Network Working Group, pp. 1-147. Retrieved From the Internet <http://www.ietf.org/rfc/rfc3588.txt>.
Sanchez et al. An Access Control System for Multimedia Content. [online] (2006). Springer-Verlag Berlin Heidelberg, pp. 1-15. Retrieved From the Internet <http://www.springerlink.com/content/h5771j31v13h0170/>.
Schulzrinne et al. The Session Initiation Protocol: Providing Advanced Telephony Services Across the Internet. [online] (Dec. 1998). Bell Labs Technical Journal, vol. 3 Issue 4, pp. 144-160. Retrieved From the Internet <http://onlinelibrary.wiley.com/doi/10.1002/bltj.2133/abstract>.
Gilfix Michael A.
Ulerich Rhys D.
International Business Machines - Corporation
Labud Jonathan R
Mims Jr. David A.
Puente Emerson
Walder, Jr. Stephen J.
LandOfFree
Developing diameter applications using diameter interface... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Developing diameter applications using diameter interface..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Developing diameter applications using diameter interface... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4288639