Photography – Fluid-treating apparatus – Fluid application to one side only of photographic medium
Reexamination Certificate
1999-08-19
2001-05-29
Rutledge, D. (Department: 2851)
Photography
Fluid-treating apparatus
Fluid application to one side only of photographic medium
C396S611000, C396S627000, C118S052000, C427S240000
Reexamination Certificate
active
06238107
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a developing apparatus for developing an object to be processed (hereinafter referred to as a ‘target object’) such as a semiconductor wafer.
2. Description of the Related Art
In a photo-resist processing step in manufacturing a semiconductor, for example, a resist film is formed by coating a resist solution on the surface of a substrate such as a semiconductor wafer (hereinafter referred to as a ‘wafer’). A predetermined pattern is then exposed upon the wafer, and the wafer is developed with a developing solution. A developing apparatus has been used to perform such developing process.
Generally, a developing apparatus has a spin chuck and a nozzle for supplying a developing solution. The spin chuck rotates a wafer while holding it by vacuum. The developing solution supply nozzle moves to a predetermined position above the spin chuck. The supply nozzle is longer than the diameter of the wafer and has a header shape. Discharge ports are arranged along a line at the bottom of the supply nozzle.
In order to supply the developing solution upon the wafer using such developing solution supply nozzle, the supply nozzle must first move to a predetermined position above the wafer held by the spin chuck, a position overlapping with the diameter of the wafer. The developing solution is then supplied to the developing solution supply nozzle. The supply nozzle discharges the developing solution from the discharge ports upon the wafer, while the wafer is rotated for more than a half turn so that the developing solution is equally supplied to the entire surface of the wafer.
SUMMARY OF THE INVENTION
In such a conventional developing apparatus, nearly pure developing solution not yet starting to react is constantly supplied to the center of the wafer. However, the developing solution with reaction in progress flows outward from the wafer center by centrifugal force. Such developing solution mixes increasingly with the pure developing solution discharged from the discharge ports, as it gets farther away from the wafer center. Thus, development becomes unequal. In other words, the development progress slows down as it gets farther away from the wafer center. Therefore, the line width is finer near the wafer center, and wider near the wafer edge.
The present invention aims to solve the above-mentioned problem. Its object is to provide a developing apparatus which performs uniform development.
To solve the above-described problem, a first aspect of the present invention is a developing apparatus having a means for rotating while holding a target object, and a nozzle divided into a plurality of areas with discharge ports arranged along a line for discharging a developing solution on the surface of the target object held and rotating. The developing apparatus also has a means for controlling the discharge amount of the developing solution so that the amount of the developing solution discharged from the discharge port disposed in an area near a rotating center of the target object is less compared to the amount discharged from the ports in other areas.
The present invention has a nozzle divided into a plurality of areas and discharging less developing solution from the area near the rotating center of the target object as compared with other areas. Therefore, the ratio of a pure developing solution supplied near the rotating center of the target object and a pure developing solution supplied around the periphery of the target object is approximately the same. Thus, unequal development may be prevented.
A second aspect of the present invention is a developing apparatus having a means for rotating while holding a target object, and a nozzle divided into a plurality of areas with discharge ports arranged along a line for discharging a developing solution on the surface of the target object held and rotating. The developing apparatus also has a means for controlling an amount of the developing solution discharged from the discharge ports in each area and disposed midway of a discharge path for discharging the developing solution.
The present invention has a nozzle divided into a plurality of areas and a means for controlling the discharge amount of the developing solution discharged from the discharge ports of each area. The nozzle and the controlling means are disposed integrally. Thereby, the discharge time and amount of the developing solution discharged from each area is controlled more accurately. The number of pipes for sending the developing solution to the nozzle may also be decreased.
These and other objects and profits of the invention can be easily defined by the following explanations and the accompanied drawings.
REFERENCES:
patent: 4564280 (1986-01-01), Fukuda
patent: 5374312 (1994-12-01), Hasebe et al.
patent: 5935331 (1999-08-01), Naka et al.
patent: 5942035 (1999-08-01), Hasebe et al.
patent: 6025012 (2000-02-01), Matsuda et al.
patent: 6086269 (2000-07-01), Bradl et al.
patent: 6165552 (2000-12-01), Anai et al.
patent: 3-222407 (1991-10-01), None
Rader Fishman & Grauer
Rutledge D.
Tokyo Electron Limited
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