Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Finishing or perfecting composition or product
Patent
1987-06-26
1989-04-11
Michl, Paul R.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Finishing or perfecting composition or product
430309, 430149, G03C 518, G03F 726
Patent
active
048206210
ABSTRACT:
The aqueous developer solution for a positive-working photoresist composition comprises, as dissolved in an aqueous solvent, a water-soluble organic basic compound and a specific non-ionic surface active agent which may be an alkyl-substituted phenyl or naphthyl ether of polyoxyethyleneglycol in a specified concentration. The developer solution is advantageous in respect of the completeness of removal of film residua and scums from the substrate surface after development so that the patterned photoresist layer is imparted with greatly increased accuracy and fidelity of the pattern reproduction.
REFERENCES:
patent: 3868254 (1975-02-01), Wemmers
patent: 4268613 (1981-05-01), Okishi
patent: 4308340 (1981-12-01), Walls
patent: 4348954 (1982-09-01), Okishi
patent: 4374920 (1983-02-01), Wanat et al.
patent: 4530895 (1985-07-01), Simon et al.
patent: 4610953 (1986-09-01), Hashimoto et al.
patent: 4613561 (1986-09-01), Lewis
patent: 4711836 (1987-12-01), Ferriera
Kohara Hidekatsu
Nakayama Toshimasa
Sato Yoshiyuki
Tanka Hatsuyuki
Doody Patrick A.
Michl Paul R.
Tokyo Ohka Kogyo Co. Ltd.
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