Developer for photosensitive resin printing plate and process fo

Details Developer for photosensitive resin printing plate and process fo Developer for photosensitive resin printing plate and process fo

1997-02-20

1999-01-05

Hamilton, Cynthia

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making printing plates

430331, 430306, 430328, 252600, G03F 730, G03F 732, G03F 740

Patent

active

058560661

ABSTRACT:
A process for producing a photosensitive resin printing plate, which comprises the steps of developing a photosensitive resin which has been exposed to light, with a composition comprising a developer for a photosensitive resin and a hydrogen-abstracting agent which can abstract hydrogen atoms from a compound upon irradiation with an active radiation, and thereafter, irradiating the surface of an obtained cured plate with an active radiation.

REFERENCES:
patent: 3574617 (1971-04-01), Skoultchi
patent: 3776889 (1973-12-01), Pande et al.
patent: 4202696 (1980-05-01), Takahashi et al.
patent: 4767642 (1988-08-01), Shimizu et al.
patent: 4791213 (1988-12-01), Gawne et al.
patent: 4861916 (1989-08-01), Kohler et al.
patent: 5043362 (1991-08-01), Balfour et al.
patent: 5045435 (1991-09-01), Adams et al.
patent: 5168087 (1992-12-01), Li Bassi et al.
Grant et al, eds, Grant & Hackh's Chemical Dictionary 5th ed, McGraw-Hill Book Co., New York, NY 1987, p. 541.
Partial English Translation of JP 04-366847 submitted.

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