Developer composition comprising phenol resins and vinylic or ac

Record receiver having plural interactive leaves or a colorless – Having a colorless color-former – developer therefor – or... – Identified organic electron acceptor other than phenolic resin

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

503217, 503225, 430138, 427150, 427147, 427151, 427152, 428327, C08G 812, D41M 500, D41M 518, D41M 522

Patent

active

048533645

ABSTRACT:
A developer composition comprising first and second developer materials, said first developer material being a finely divided thermoplastic phenolic resin and said second developer material being a finely divided thermoplastic vinylic or acrylic resin containing pendant developer moieties, said first and second developer materials being sufficiently compatible that upon heating they coalesce to form a non-tackey, and scratch resistant film.

REFERENCES:
patent: 3732120 (1973-05-01), Brockett et al.
patent: 3864146 (1975-02-01), Oda et al.
patent: 3874895 (1975-04-01), Hayashi et al.
patent: 3924027 (1975-12-01), Saito et al.
patent: 3983292 (1976-09-01), Saito et al.
patent: 4025490 (1977-05-01), Weaver
patent: 4226962 (1980-10-01), Stolfo
patent: 4399209 (1983-08-01), Sanders et al.
patent: 4440846 (1984-04-01), Sanders et al.
patent: 4554235 (1985-11-01), Adair et al.
patent: 4647952 (1987-03-01), Pokora et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Developer composition comprising phenol resins and vinylic or ac does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Developer composition comprising phenol resins and vinylic or ac, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Developer composition comprising phenol resins and vinylic or ac will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-131541

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.