Determining wafer orientation in spectral imaging

Details Determining wafer orientation in spectral imaging Determining wafer orientation in spectral imaging

2006-12-19

2006-12-19

Pham, Hoa Q. (Department: 2877)

Optics: measuring and testing

Dimension

Thickness

C356S326000

Reexamination Certificate

active

07151609

ABSTRACT:
Devices and methods for determining wafer orientation in spectral imaging are described. The devices and methods generate an image of a wafer that includes at least one spectral dimension. One or more properties are determined from the spectral dimension, and a map is generated based on the property. The generated map is compared to at least one other map, and data or information of the comparison is used to locate a region of the wafer, for example a measurement pad or other structure.

REFERENCES:
patent: 5333049 (1994-07-01), Ledger
patent: 5543919 (1996-08-01), Mumola
patent: 5659172 (1997-08-01), Wagner et al.
patent: 5787190 (1998-07-01), Peng et al.
patent: 5856871 (1999-01-01), Cabib et al.

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