Optics: measuring and testing – By configuration comparison – With projection on viewing screen
Reexamination Certificate
2007-03-28
2010-06-01
Toatley, Jr., Gregory J (Department: 2877)
Optics: measuring and testing
By configuration comparison
With projection on viewing screen
C356S237100, C356S237500, C356S601000, C356S639000, C438S014000, C438S016000
Reexamination Certificate
active
07728976
ABSTRACT:
To generate a simulated diffraction signal, one or more values of one or more photoresist parameters, which characterize behavior of photoresist when the photoresist undergoes processing steps in a wafer application, are obtained. One or more values of one or more profile parameters are derived using the one or more values of the one or more photoresist parameters. The one or more profile parameters characterize one or more geometric features of the structure. A simulated diffraction signal is generated using the one or more values of the one or more profile parameters. The simulated diffraction signal characterizes behavior of light diffracted from the structure. The generated simulated diffraction signal is associated with the one or more values of the one or more photoresist parameters. The generated simulated diffraction signal, the one or more values of the one or more photoresist parameters, and the association between the generated simulated diffraction signal and the one or more values of the one or more photoresist parameters are stored.
REFERENCES:
patent: 6194234 (2001-02-01), Huang et al.
patent: 6943900 (2005-09-01), Niu et al.
patent: 7567353 (2009-07-01), Bischoff et al.
patent: 7593119 (2009-09-01), Niu et al.
patent: 2004/0267397 (2004-12-01), Doddi et al.
patent: 2005/0209816 (2005-09-01), Vuong et al.
patent: 2007/0185684 (2007-08-01), Vuong et al.
patent: 2417420 (2006-03-01), None
Arthur, G. G. et al. (1997). “Enhancing the Development Rate Model for Optimum Simulation Capability in the Subhalf-Micron Regime,”Proceedings of SPIE3049:189-200.
Haykin, S. (1999).Neural Networks. 2nd edition, M. Horton ed., Prentice Hall: Upper Saddle River, New Jersey, 9 pages (Table of Contents).
Ilkayev, D. R. et al. (Autumn 1994). “Predicting Positive Photoresist Post Exposure Bake Effects: Comparison of Simulation Methods,”Microlithography World, pp. 17-20.
Levinson, H, J. (2001).Principles of Lithography. SPIE Press: Bellingham, Washington, Chapter 4.3-4.7, pp. 109-132.
Levinson, H, J. (2001). “Photoresists” Chapter 3 InPrinciples of Lithography. SPIE Press: Bellingham, Washington, pp. 55-96.
Mack, C. A. (Autumn 1994). “Photoresist Development,”Microlithography World, pp. 22-24.
Mack, C. A. (Feb. 2002). “Using the Normalized Image Log-Slope Part 5: Development,”Microlithography World, pp. 18, 26.
Mack, C. A. (Spring 1999). “Absorption and Reflectivity: Designing the Right Photoresist,”Microlithography World, pp. 20-21.
Mack, C. A. (Summer 1997). “Antireflective Coatings,”Microlithography World, pp. 29-30.
Mack, C. A. (Winter 1994). “Positive Photoresists—Exposure,”Microlithography World, pp. 21-23.
Mack, C. A. (Winter 1995). “Photoresist Development (Cont.),”Microlithography World, pp. 24-26.
Reichmanis, E. et al. (Nov./Dec. 1992). “Chemically Amplified Resists for Deep-UV Lithography: A New Processing Paradigm,”Microlithography World, pp. 7-14.
U.S. Appl. No. 11/729,498, filed Mar. 28, 2007 for Bischoff et al.
U.S. Appl. No. 11/729,700, filed Mar. 28, 2007 for Bischoff et al.
Bischoff Joerg
Hetzer David
Alli Iyabo S
Madriaga Manuel B.
Toatley Jr. Gregory J
Tokyo Electron Limited
LandOfFree
Determining photoresist parameters using optical metrology does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Determining photoresist parameters using optical metrology, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Determining photoresist parameters using optical metrology will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4243645