Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate
2006-06-23
2009-02-10
Dinh, Paul (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Nanotechnology related integrated circuit design
C716S030000, C716S030000, C716S030000
Reexamination Certificate
active
07490304
ABSTRACT:
Methods are disclosed for determining a geometrical configuration of an interconnect structure of a test structure without cross-sectioning or optical measurements. In one embodiment, the method includes obtaining simulation data correlating capacitance data, resistance data and geometrical configuration data for a plurality of interconnect structures having different geometrical configurations; measuring a capacitance value and a resistance value from the interconnect structure of the test structure; and determining the geometrical configuration of the interconnect structure by comparing the capacitance value and the resistance value to the simulation data.
REFERENCES:
patent: 5610833 (1997-03-01), Chang et al.
patent: 5790479 (1998-08-01), Conn
patent: 6219631 (2001-04-01), Oh et al.
patent: 6887791 (2005-05-01), Jung
patent: 7254792 (2007-08-01), Rekhi et al.
patent: 2003/0070148 (2003-04-01), Chang et al.
patent: 2006/0161412 (2006-07-01), Angyal et al.
patent: 2007/0118349 (2007-05-01), Jakatdar et al.
“A Method of precise estimation of Physical Parameter in LSI Interconnect Structures”, Toshiki Kanamoto, Tetsuya Watanabe, and Mitsutoshi, IEIC Trans—Fundamentals, vol. E88-A, N. 12, @Dec. 2005.
“Interconnect Strategy in Deep-Submicron Dram Technology”, by Jae-Kyung, Si-Hong Kim, Yong Yae Park, Se-Jun Kim, and Jin Yong Chun , @IEEE 2000.
Mina Essam
Piper William
Woods, Jr. Wayne H.
Dinh Paul
Hoffman Warnick LLC
International Business Machines - Corporation
Kotulak Richard M.
Nguyen Nha T
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