Determining die test protocols based on process health

Data processing: measuring – calibrating – or testing – Measurement system in a specific environment – Electrical signal parameter measurement system

Reexamination Certificate

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C702S117000, C702S118000, C702S182000

Reexamination Certificate

active

08041518

ABSTRACT:
A method includes receiving a first set of parameters associated with a subset of a plurality of die on a wafer. A die health metric is determined for at least a portion of the plurality of die based on the first set of parameters. The die health metric includes at least one process component associated with the fabrication of the die and at least one performance component associated with an electrical performance characteristic of the die. At least one of the die is tested. A protocol of the testing is determined based on the associated die health metric.

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