Detector array module fabrication

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156297, C23F 102, H01J 502, G06K 900, H05K 306

Patent

active

043527159

ABSTRACT:
A photo-detector array module is disclosed wherein: (a) the focal plane array of photo-detectors is in electrical contact with thin film conductors supported on thin ceramic layers extending perpendicular to the focal plane, and (b) sub-module structures, each composed of such layers, have complementary shapes (such as "O-shaped" and "I-shaped") to provide "component wells" for electronics within the three dimensional space defined at one end by the two-dimensional area of the focal plane. In order to fabricate such a module satisfactorily, a method is disclosed in which each unimaged layer (i.e., layer whereon the thin film conductors have not yet been photo-delineated) is individually laminated to the prior structure, and the photo-delineation process on the unimaged layer includes an optical alignment step to insure alignment of the thin film conductors on each layer with those on preceding layers.

REFERENCES:
patent: 3631251 (1971-12-01), Lehovec
patent: 3748479 (1973-07-01), Lehovec
patent: 3852714 (1974-12-01), Carson
patent: 3903594 (1975-09-01), Koneval
patent: 3962002 (1976-06-01), Finkbeiner et al.
patent: 3970990 (1976-07-01), Carson

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