Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1991-06-19
1992-05-26
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156627, 156644, 156655, 156656, 1566591, 156668, 156902, 427 10, 427 97, 427 98, 427307, 437230, B44C 122, B29C 3700, C23F 100
Patent
active
051164639
ABSTRACT:
A method for detecting the completion of electrolessly depositing metal into a via. The method includes providing a non-autocatalytic detection mask with an opening over a via containing an autocatalytic material, electrolessly depositing a conductive metal into the via which fails to plate to the mask, and continuing the deposition until metal in the via contacts the mask, at which time the electrochemical potential of the mask changes and the metal plates to and covers the entire mask. The completion of the electroless via fill can be detected by changes in both the appearance and electrochemical potential of the mask.
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patent: 4692349 (1987-09-01), Georgiou et al.
patent: 4793895 (1988-12-01), Kaanta et al.
patent: 4917759 (1990-04-01), Fisher et al.
patent: 4954214 (1990-09-01), Ho
patent: 4970106 (1990-11-01), DiStefano
Tessier et al, "Process Considerations in Fabricating Thin Film Multichip Modules", International Electronics Packaging Society Conference Proceedings 1989, pp. 294-313.
German Randy L.
Lin Charles W. C.
Sigmond David M.
Yee Ian Y. K.
Microelectroncs and Computer Technology Corporation
Powell William A.
Sigmond David M.
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