Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation
Reexamination Certificate
2005-10-17
2009-02-10
Andújar, Leonardo (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Physical deformation
C257S684000, C257S922000
Reexamination Certificate
active
07489013
ABSTRACT:
A semiconductor device. The device includes a substrate and an integrated circuit chip. The device also includes an electrically or thermally reactive layer located between a top surface of the substrate and a bottom surface of the integrated circuit chip, wherein the reactive layer is positioned such that detection of tampering causes the reactive layer to be electrically or thermally energized such that the semiconductor device is at least partially destroyed.
REFERENCES:
patent: 3725671 (1973-04-01), Keister et al.
patent: 3860835 (1975-01-01), Brymer et al.
patent: 4962415 (1990-10-01), Yamamoto et al.
patent: 5027397 (1991-06-01), Double et al.
patent: 5233505 (1993-08-01), Chang et al.
patent: 5858500 (1999-01-01), MacPherson
patent: 6201707 (2001-03-01), Sota
patent: 6524462 (2003-02-01), Lowe
patent: 6930023 (2005-08-01), Okada et al.
patent: 2004/0244889 (2004-12-01), Sailor et al.
patent: 10252329 (2004-05-01), None
U.S. Appl. No. 11/043,626, filed Jan. 25, 2005.
Office Action issued on Mar. 11, 2008 in U.S. Appl. No. 11/043,626.
Office Action issued on Mar. 27, 2008 in U.S. Appl. No. 11/252,402.
Office Action issued on Mar. 5, 2007 in U.S. Appl. No. 11/043,626.
Office Action issued on Jun. 26, 2007 in U.S. Appl. No. 11/043,626.
U.S. Appl. No. 11/252,402, filed Oct. 18, 2005.
Office Action issued on Oct. 9, 2007 in U.S. Appl. No. 11/252,402.
U.S. Appl. No. 11/944,771, filed Nov. 26, 2007.
D3 Tamper Respondent Systems Product Brochure, 2001, 6 pages.
D3 Technology Tamper Respondent Sensors and Enclosures, W.L. Gore & Associates (UK) Ltd. Dundee Technology Park, Dundee DD2 1JA, Scotland, 2 pages.
Buller Randall David
Chubin David E.
Khalifa Colleen L.
Pham Cuong V.
Andújar Leonardo
Teledyne Technologies Incorporated
LandOfFree
Destructor integrated circuit chip, interposer electronic... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Destructor integrated circuit chip, interposer electronic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Destructor integrated circuit chip, interposer electronic... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4120723