Metal fusion bonding – Process of disassembling bonded surfaces – per se
Patent
1987-02-18
1989-08-22
Seidel, Richard K.
Metal fusion bonding
Process of disassembling bonded surfaces, per se
228 19, 228 51, B23K 2900
Patent
active
048588202
ABSTRACT:
A technique is provided for desoldering circuit components employing a desoldering aid that fits like a cap on a standard size rectangular circuit component. The aid has a rectangular top of high thermal conductivity metal substantially the same size as the circuit component. At least a pair of integral sides along opposite edges of the top are bent normal to the top and are not further apart than the outside of the electrical leads on the opposite sides of the circuit component for good thermal contact therewith. The depth of the inside of the box is greater than the height of the top of the component so that there is no contact between the top of the box and the top of the component. The top of the box over the component is heated sufficiently to melt solder on the electrical leads. The box and component can then be lifted together from the printed circuit board.
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Hexacon Electric Co. brochure, "SMD Slotted Spade & Tunnel Tips, to Fit Hexacon Soldering Irons," 1985.
Plato Products, Inc.
Seidel Richard K.
Skillman Karen
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