Desmearing and plated-through-hole method

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

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Details

2041923, 414217, 427 97, C23C 1404, C23C 1420, C23C 1438, C23C 1456

Patent

active

048635774

ABSTRACT:
An integrated plasma desmearing and plated-through-hole method to first plasma desmear a printed circuit board and then plate through the holes of the plated circuit board by sputtering. The method comprises serially transporting the printed circuit boards through a plurality of vacuum chambers serially interconnected together by means of a transport system. The transporting method comprises the steps of passing the printed circuit board from one vacuum chamber into the succeeding vacuum chamber in such a manner that the printed circuit board is progressively released from suspension by longitudinally transportable clips to span the distance to the aligned transport mechanism in the succeeding vacuum chamber to be progressively gripped by the clips thereof. Preferably, five vacuum chambers are provided including a loading chamber, a desmearing chamber, a plating preparation chamber, a plating chamber and an unloading chamber. Airtight isolation doors isolate each chamber from the others.

REFERENCES:
patent: 3100637 (1963-08-01), Brown
patent: 4012307 (1977-03-01), Phillips
patent: 4172021 (1979-10-01), Gladish
patent: 4351697 (1982-09-01), Shauefield et al.
patent: 4425210 (1984-01-01), Fazlin
patent: 4587002 (1986-05-01), Bok
Cairns, M., Sputtering: a Surface Treatment for Economy and Five Finish, Design Engineering, Nov. 1970, pp. 83-85.
Barber, G. F., Two-Chamber Air-to-Vacuum Lock System, IBM Technical Disclosure Bulletin, vol. 11, No. 7, Dec. 1968, pp. 757-758.
Catalog of "Torus.COPYRGT." Sputtering Sources, published by Enerjet, a division of Kurt J. Lesker Co., undated, pp. 1-14.

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