Desmear and etchback using NF.sub.3 /O.sub.2 gas mixtures

Details Desmear and etchback using NF.sub.3 /O.sub.2 gas mixtures Desmear and etchback using NF.sub.3 /O.sub.2 gas mixtures

1987-09-25

1988-11-29

Lacey, David L.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156646, 156668, 156902, 252 793, C09K 1308, B29C 3700

Patent

active

047879572

ABSTRACT:
The present invention is directed to a method for plasma desmear and etchback of epoxy and polyimide materials from a multilayered or double sided printed circuit board using a plasma gas composition in the range of 20-45% NF.sub.3, the remainder being O.sub.2.

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