Design tool for integrated circuit design

Details Design tool for integrated circuit design Design tool for integrated circuit design

2006-01-03

2006-01-03

Siek, Vuthe (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

Reexamination Certificate

active

06983438

ABSTRACT:
A method and software relating to determining whether a square die fits into a package without generating drawings. Package parameters are defined and used to calculate die characteristics. Calculated die characteristics are compared to defined package parameters and/or to calculated package parameters to make a determination of whether a die with the calculated characteristics fits into a package as defined by its parameters. The method and software allow design of dies to fit packages, the design of packages to fit dies, and simultaneous design of dies and packages that fit one another.

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