Design aid apparatus, design aid method, and...

Details Design aid apparatus, design aid method, and... Design aid apparatus, design aid method, and...

2007-06-26

2007-06-26

Dinh, Paul (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000

Reexamination Certificate

active

11042978

ABSTRACT:
A multilayer wiring board formed by laminating a plurality of dielectrics including a specific dielectric capable of embedding components therein is separated into first and second portions that are respectively made up of sets of dielectrics on opposite sides of the specific dielectric. A first aid unit stores design information about placement of objects to the first portion, and manages and displays the design information according to a user command to aid in design of the first portion. A second aid unit stores design information about placement of objects to the second portion, and manages and displays the design information according to a user command to aid in design of the second portion. Further, the first and second aid units each store design information about placement of boundary objects which extend to both the first and second portions, and cooperatively manage the design information and each display it.

REFERENCES:
patent: 6629302 (2003-09-01), Miura et al.
patent: 2001/0047508 (2001-11-01), Miura et al.
patent: 2002/0178429 (2002-11-01), Nakayama et al.
patent: 2005/0022149 (2005-01-01), Smith et al.
patent: 2005/0138592 (2005-06-01), Morgan et al.
patent: 3087669 (2000-07-01), None
patent: 2001-243271 (2001-09-01), None

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