Desensitizing solution for offset printing

Details Desensitizing solution for offset printing Desensitizing solution for offset printing

1996-07-03

1997-12-09

Le, Hoa Van

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making printing plates

430300, 430302, 430327, 430331, G03F 730

Patent

active

056959125

ABSTRACT:
A desensitizing solution for offset printing is provided, which is characterized by containing an inorganic ionic polymer of basic aluminum chloride or a derivative thereof, represented by the general formula basic aluminum chloride or a derivative is 5 to 50% by weight and the pH of the solution is 2 to 5. This solution can be free from a ferrocyanic or ferricyanic compound but provide a hydrophilic coating layer with a strong physical strength on a non-image area.

REFERENCES:
patent: 3544476 (1970-12-01), Alba et al.
patent: 3697304 (1972-10-01), Uchida et al.
patent: 3908547 (1975-09-01), Rochlitz
patent: 3915904 (1975-10-01), Tonkyn et al.
patent: 4369173 (1983-01-01), Causland et al.
patent: 4401574 (1983-08-01), Farrington et al.
patent: 4655934 (1987-04-01), Rose et al.
Webster's New World Dictionary, 3rd College Edition, V. Neufeldt ed. Simon & Schuster, Inc. NY (1988) English Abstract p. 4., 561,769.
English Abstract (JOAB) file on APS) of Japanese Patent 59-179200; Oct. 11, 1984 pub.
English Abstract (JOAB file on APS) of Japanese Patent 58-112096; Jul. 4, 1983 pub.
English Abstract (JOAB file on APS) of Japanese Patent 58-51998; Mar. 26, 1983 pub.

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