Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1997-08-21
2000-04-18
McDonald, Rodney
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
20429815, 20429831, 118720, 118728, 156345, C23C 1434, C23C 1600, C23C 1450
Patent
active
060511222
ABSTRACT:
A readily removable deposition shield assembly for processing chambers such as chemical vapor deposition (CVD), ion implantation, or physical vapor deposition (PVD) or sputtering chambers, is disclosed. The shield assembly includes a shield member which is mounted to the chamber for easy removal, such as by screws, and defines a space along the periphery of the substrate support. A shadow ring is inserted into the peripheral space and is thus mounted in removable fashion and is automatically centered about the substrate by an alignment ring. The alignment ring removably rests upon a flange extending from the outer periphery of an electrostatic chuck. The shadow ring overlaps the cylindrical shield member, the alignment ring and the peripheral edge of a substrate retained by the chuck. Collectively, these components prevent deposition on the chamber and hardware outside the processing region.
REFERENCES:
patent: 5262029 (1993-11-01), Erksine et al.
patent: 5280156 (1994-01-01), Niori et al.
patent: 5447570 (1995-09-01), Schmitz et al.
patent: 5803977 (1998-09-01), Tepman et al.
Applied Materials Inc.
McDonald Rodney
LandOfFree
Deposition shield assembly for a semiconductor wafer processing does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Deposition shield assembly for a semiconductor wafer processing , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Deposition shield assembly for a semiconductor wafer processing will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2333858