Deposition rate regulation by computer control of sputtering sys

Details Deposition rate regulation by computer control of sputtering sys Deposition rate regulation by computer control of sputtering sys

1978-04-17

1979-09-04

Mack, John H.

Chemistry: electrical and wave energy

Processes and products

Vacuum arc discharge coating

204298, C23C 1500

Patent

active

041667832

ABSTRACT:
A sputtering system utilizes a computer to monitor the power dissipation in the sputtering source and to accumulate the history of usage of the particular sputtering target. Desired deposition rate information is input to the computer, which establishes and maintains the desired rate and controls the plasma discharge to compensate for aging and deterioration of the target. End of useful target life is determined by the computer from objective criteria to trigger appropriate actions.

REFERENCES:
patent: 4043889 (1977-08-01), Kochel

Affiliated with

Also associated with

Rating

Deposition rate regulation by computer control of sputtering sys does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Deposition rate regulation by computer control of sputtering sys, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Deposition rate regulation by computer control of sputtering sys will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2127629