Deposition process

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

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427259, 430312, 430319, G03C 500

Patent

active

044242719

ABSTRACT:
A desired feature of deposition material is produced on a substrate by forming an adhesion inhibitor on the substrate in a pattern whose inner edges are adjacent the bounds of the feature being produced. A seedlayer is deposited over the adhesion inhibitor and exposed portions of the substrate, and a mask is formed over the seedlayer adjacent the edges of the adhesion inhibitor, the inner edges of the mask defining the feature being produced. A deposition material is deposited over the exposed seedlayer, and the mask is removed. Unwanted portions of the seedlayer and deposition layer are removed by mechanically lifting off. The adhesion inhibitor serves to inhibit the bonding of the seedlayer to the substrate sufficiently to enable the mechanical lift-off. The adhesion inhibitor is removed, either by lifting off with the seedlayer and deposition layer, or subsequently.

REFERENCES:
patent: 4224361 (1980-09-01), Romankiw
patent: 4238559 (1980-12-01), Feng et al.
patent: 4256816 (1981-03-01), Dunkleberger

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