Deposition-preventing part for physical vapor deposition apparat

Details Deposition-preventing part for physical vapor deposition apparat Deposition-preventing part for physical vapor deposition apparat

1996-10-30

1999-09-21

Dang, Thi

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

118720, 118721, C23C 1400

Patent

active

059549297

ABSTRACT:
A deposition-preventing part, particularly a masking tool, which is used over an area to be protected from adhesion of a physical vapor deposition film, for physical vapor deposition apparatuses which are used to form physical vapor deposition films of metals, particularly noble metals, on CD-ROM, CD-R or CD-E substrates. One or more of a solder-plated Cu wire, a solder-plated Cu foil tape, an Al foil tape and a synthetic resin tape are attached, in a peelable manner, on a solder film formed on the surface of the substrate of a deposition-preventing part such as a masking tool, which has a surface roughness of 0.01-1 .mu.m when expressed as the arithmetic mean roughness defined according to JIS B 0601, a thickness of 5-100 .mu.m and a melting point of 100-450.degree. C.

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