Deposition of polymer films by means of ion beams

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156646, 156668, 156904, 204192EC, 204192E, 427 431, 4272556, 430328, B44C 122, C03C 1500, C03C 2506, B29C 1708

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active

044604360

ABSTRACT:
A patterned polymer film is deposited on a substrate by pattern-wise exposing a monomer vapor to a beam of ions and dry developing by etching with oxygen plasma.

REFERENCES:
I. Adesida, J. D. Chinn, L. Rathbun, E. D. Wolf, J. Vac. Sci. Technol., 21(2),Jul./Aug., pp. 666-671 (1982), Dry Development of Ion Beam Exposed PMMA Resist.
H. Kuwano, K. Yoshida, S. Yamazaki, Japanese J. Appl. Physics, 19(No. 10) L615 1980, Dry Development of Resists Exposed to Focused Gallium Ion Beam.
G. N. Taylor, T. M. Wolf, J. M. Moran, J. Vac. Aci. Technol., 19(4) Nov./Dec. 872 (1981), Organosilicon Monomers for Plasma-Developed X-Ray Resists.
S. Hattori, ACS Org. Coating & Plastic Chem., Sep. 12-17, 1982, Kansas City mtg., Organic Coatings and Applied Polymer Science Proceedings, vol. 47, pp. 136-140.

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