Deposition of metals on stepped surfaces

Details Deposition of metals on stepped surfaces Deposition of metals on stepped surfaces

1988-08-05

1990-07-31

Pianalto, Bernard

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 35, 427 42, 427250, 427256, 427314, B05D 306

Patent

active

049449613

ABSTRACT:
A high ionization efficiency process for partially ionized beam deposition of metals or metal alloys on substrates such as semiconductor wafers is described. Metal vaporized from a crucible is partially ionized at the crucible exit, and the ionized vapor is drawn to the substrate by an imposed bias. Control of substrate temperature allows non-conformal coverage of stepped surfaces such as vias or trenches. When higher substrate temperatures are used, stepped surfaces are planarized.

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