Deposition of integrated circuit fabrication materials using...

Details Deposition of integrated circuit fabrication materials using... Deposition of integrated circuit fabrication materials using...

2006-08-15

2006-08-15

Ghyka, Alexander (Department: 2812)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

C438S005000, C438S014000

Reexamination Certificate

active

07091134

ABSTRACT:
In one embodiment, an integrated circuit (IC) fabrication material is dispensed from a print head by dividing its nozzles into several groups, and sequentially allowing each group to fire. The nozzles may be grouped based on the amounts of material they dispense. For example, the nozzles may be grouped by drop volume or drop mass. In one embodiment, an IC fabrication material is dispensed on a substrate by controlling a firing sequence of a nozzle to promote merging of material on the substrate. The firing sequence may also be altered to take into account the firing sequence of adjacent nozzles.

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Charge Sensitive Preamplifier A250, State-of-the-Art, Webpage [online][retrieved on Feb. 6, 2002]. Retrieved from the Internet: URL:http://www.amptek.com/a250.htm>.
IJT print head, Ink Jet Technology Inc., Webpage [online][retrieved on Feb. 8, 2002]. Retrieved from the Internet: URL:http://www.amptek.com/a250.html>.

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