Deposition method for compound semiconductor forming device

Single-crystal – oriented-crystal – and epitaxy growth processes; – Forming from vapor or gaseous state – With decomposition of a precursor

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117 92, 117103, C30B 2616

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054290686

ABSTRACT:
A deposition method of a compound semiconductor forming a semiconductor device comprises the steps of; covering the surface of a compound semiconductor containing a V group element with a III group element with a thickness of one or more monolayers; and forming a second compound semiconductor containing a V group element different from said V group element on said III group element while utilizing said III group element as a protective film for preventing the desorption of said V group element.

REFERENCES:
patent: 4931132 (1990-06-01), Aspnes et al.
patent: 5296088 (1994-03-01), Kodama et al.
"OMVPE growth of GaInAs/InP and GaInAs/ GaInAsP quantum wells"; Kamei et al.; I. Cryst Growth 107 (1991), pp. 567-572.
"Effect of growth parameters on the interfacial structure of GaInAs/InP quantum wells"; Hergeth et al.; I. Cryst. Growth 107 (1991) pp. 537-542.
H. Kamei and H. Hayashi, Journal of Crystal Growth 107, 1991, pp. 567-572, North-Holland.
J. Hergeth et al., Journal of Crystal Growth 107, 1991, pp. 537-542, North-Holland.
Eric Tournie et al., Appl. Phys. Lett. 61(7), 17 Aug. 1992, pp. 846-848.

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