Deposition apparatus using a perforated pumping plate

Details Deposition apparatus using a perforated pumping plate Deposition apparatus using a perforated pumping plate

1992-11-12

1994-03-08

Bueker, Richard

Coating processes

Coating by vapor, gas, or smoke

Metal coating

4272481, 427250, 4272555, 118720, 118725, 118728, 118500, 118503, C23C 1600

Patent

active

052925544

ABSTRACT:
In a deposition apparatus, a barrier is used to separate a process gas section from the section of the chamber below the substrate on which a metal layer is deposited. The substrate is supported on a support. During an unloading stage, purge gas is introduced into the chamber below the substrate. To prevent the substrate from being moved on the support by the purge gas, the barrier is perforated so that the process gas can flow through the barrier and into a vacuum manifold system.

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patent: 4990374 (1991-02-01), Keeley et al.
patent: 5013400 (1991-05-01), Kurasaki et al.
Rana, Virendia, D. S. et al., Editors, Advanced Metallization for BLSI Applications, Materials Research Society, pp. 453-462, Pittsburgh, Pa. 1992. (Paper presented Oct. 8, 9, or 10, 1991, entitled "An Integrated Tungsten Plug Fabrication Process", by Mak et al.).

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