Deposition apparatus and method for enhancing step coverage and

Details Deposition apparatus and method for enhancing step coverage and Deposition apparatus and method for enhancing step coverage and

1989-12-27

1992-05-19

Nguyen, Nam

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20429806, 20429808, 20429811, 20429816, C23C 1434

Patent

active

051145561

ABSTRACT:
A layer of a substance such as a metal, non-metal or metal alloy is deposited, preferably by sputtering, onto the surface of a substrate such as a semiconductor wafer. The adatoms of the deposited layer are mobilized by being bombarded with a flux of low energy neutral atoms or molecules at an oblique angle of incidence to enhance step coverage and/or planarization of the semiconductor wafer. The neutral atoms or molecules are formed within the plasma by applying a negative bias potential to a reflector electrode which will attract positive ions from the plasma. The neutral atoms or molecules elastically scatter from the surface of the electrode to bombard the adatoms being deposited during the operation of the sputter source.

REFERENCES:
patent: 4595482 (1986-06-01), Mintz
patent: 4604180 (1986-08-01), Hirukawa et al.
patent: 4627904 (1986-12-01), Mintz
patent: 4664935 (1987-05-01), Strahl
patent: 4693805 (1987-09-01), Quazi
patent: 4717462 (1988-01-01), Homma et al.
patent: 4756810 (1988-07-01), Lamont, Jr. et al.
patent: 4818359 (1989-04-01), Jones et al.
"Planar Deposition of Aluminum by RF/DC Sputtering with RF Bias", J. Electro-Chemical Soc., vol. 132, No. 6, pp. 1466-1472 (1985).
"Significant Improvement in Step Coverage Using Bias Sputtered Aluminum", Vac. Sci. Technol. A, vol. 4, No. 3, pp. 457-460 (May/Jun. 1986).
Vossen et al., "Thin Film Processes", Academic Press, 1978, p. 14-19.

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