Deposited tunneling oxide

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257317, 257320, H01L 29788

Patent

active

059775858

ABSTRACT:
An apparatus and method for depositing a tunneling oxide layer between two conducting layers utilizing a low pressure, low temperature chemical vapor depostion (LPCVD) process is disclosed wherein tetraethylorthosilicate (TEOS) is preferably used. As applied to an electrically erasable programmable read only memory (EEPROM) device having polysilicon layers, the apparatus is constructed by forming a first layer of polysilicon, patterned as desired. A layer of silicon dioxide is then deposited by decomposition of TEOS to form the tunneling oxide to a predetermined thickness. If enhanced emission structures are desired, a layer of relatively thin tunneling oxide may be grown on the first layer of polysilicon. The oxide layer is then annealed and densified, preferably using steam and an inert gas at a specific temperature. A second layer of polysilicon is then formed on top of the tunneling oxide.

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patent: 4851370 (1989-07-01), Doklan et al.
Korma, E.J. et al. "SiO.sub.2 Layers on Polycrystalline Silicon," in Insulating Films on Semiconductors, J.F Verweij and D.R. Wolters, eds., Elsevier Science Publishing Co., Inc, N.Y., N.Y. pp. 278-281.
Peek, H.L., "The Characterization and Technology of Deposited Oxides for EEROM", in Insulating Films on Semiconductors, J.F. and D.R. Wolters, eds., Elsevier Science Publishers B.V., 1983, pp. 261-265.

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