Depopulation of a ball grid array to allow via placement

Details Depopulation of a ball grid array to allow via placement Depopulation of a ball grid array to allow via placement

2007-10-09

2007-10-09

Clark, Jasmine (Department: 2815)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S612000, C438S613000, C257S735000, C257S737000, C257S780000, C257SE23020, C257SE23069

Reexamination Certificate

active

11523153

ABSTRACT:
The present invention provides an apparatus and methods for the functionality of an integrated circuit. An exemplary embodiment according to an aspect of the present invention includes a ball grid array having open spaces therein. Within the open spaces, pairs of opposite polarity vias are clustered to minimize current path inductance by exploiting mutual inductance between vias of opposite current flow. In an illustrative embodiment, capacitors are coupled to the vias to further reduce current path inductance.

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